February 17, 2021
11 am PST
The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles along the way including everything from diverse teams scattered across the world to simply not understanding how the manufacturing process of die bonding, wire bonding or vacuum reflow impacts the package design and vise versa. In this 3-part series, we will present the challenges faced from package design and prototyping, through process development and process optimization to ensure the device can indeed be manufactured with the desired throughput and quality.
In Part 1, we'll present the challenges of manufacturing semiconductor packaging that many small, start-up companies may face. Often, start-up companies or divisions of larger companies may not have a complete team available and might not be aware of how to take their package from design to full-scale production. In the following two parts, we will present the challenges of optimizing the manufacturing process, as well as the advantages of out-sourcing process optimization to speed time to market.