Position Overview
Palomar Technologies’ Advanced Solutions Division (ASD) provides high-complexity engineering services to semiconductor, microelectronics, photonics, medical, aerospace, defense, and advanced packaging customers. ASD’s core services include process development, prototyping, contract manufacturing, training, consulting, and process optimization using microelectronic assembly processes such as die attach, pick-and-place, wire bonding, vacuum soldering, dispensing, curing, inspection, and related packaging operations.
We are seeking a Process Engineer II with direct experience of operating, programming, troubleshooting, or developing processes on back-end semiconductor manufacturing and assembly equipment. This role is intended for an engineer who can contribute quickly in a hands-on, customer-facing, high-mix environment with limited ramp time.
The ideal candidate will have practical experience with equipment such as die bonders, pick-and-place systems, wire bonders, dispense systems, soldering systems, optical/metrology tools, or similar precision assembly platforms. They should be comfortable owning process development work, identifying relevant process variables, communicating risks early, and driving customer projects from initial requirements through successful execution.
Key Responsibilities
Back-End Assembly Process Development
- Develop, optimize, and execute microelectronics assembly processes for customer applications, including:
- Die attach
- Pick-and-place
- Wire bonding
- Wedge bonding / ball bonding
- Vacuum soldering
- Dispensing and curing
- Prototype and low-volume assembly
- Translate customer requirements, drawings, and statements of work into practical process plans.
- Identify critical process variables, risks, and controls needed to meet customer requirements.
- Perform hands-on setup, execution, inspection, and troubleshooting in a cleanroom/lab environment.
- Support both prototype development and repeatable production-style builds.
Equipment Operation, Programming & Troubleshooting
- Operate and program back-end semiconductor assembly equipment such as die bonders, wire bonders, pick-and-place tools, dispense systems, soldering systems, and related packaging equipment.
- Troubleshoot process and equipment issues involving:
- Vision / pattern recognition
- Tooling and tool selection
- Pick/place accuracy
- Bond quality
- Dispense repeatability
- Z-height, force, temperature, vacuum, alignment, and motion-related variables
- Understand the relationship between equipment setup, program structure, material behavior, and final assembly quality.
- Adapt existing equipment programs or develop new programs to support customer-specific requirements.
- Work with equipment support teams or vendors when needed to resolve technical issues.
Customer-Facing Engineering Support
- Work directly with customers to understand technical requirements, constraints, and desired outcomes.
- Provide feedback on manufacturability, process feasibility, material risks, tooling needs, and design concerns.
- Communicate project status, technical issues, risks, and recommended paths forward in a clear and professional manner.
- Support customer visits, development reviews, and technical discussions as needed.
Project Ownership & Execution
- Own assigned projects from kickoff through completion, including planning, execution, documentation, and closeout.
- Manage multiple projects in a high-mix environment with changing priorities and short timelines.
- Raise flags early when technical, schedule, material, or quality risks are identified.
- Propose practical solutions and test plans when issues arise.
- Balance speed, quality, and technical rigor in customer-driven work.
Documentation & Knowledge Capture
- Document process settings, equipment programs, inspection results, lessons learned, and customer-specific requirements.
- Prepare process travelers, setup notes, inspection summaries, and development reports.
- Contribute to ASD’s internal knowledge base by capturing reusable process learning and best practices.
- Support development of standard work, training materials, and process guidelines as ASD scales.
Required Qualifications
- Bachelor’s degree in Engineering, Materials Science, Physics, or a related technical discipline, or equivalent combination of education and relevant hands-on experience.
- Typically, 3–7 years of relevant process engineering experience, preferably in semiconductor packaging, microelectronics assembly, photonics assembly, medical device assembly, aerospace electronics, or high-reliability manufacturing.
- Direct hands-on experience with at least one of the following:
- Die attach equipment
- Pick-and-place systems
- Wire bonders
- Wedge bonders / ball bonders
- Dispense systems
- Vacuum soldering or thermal process equipment
- Precision assembly or packaging systems
- Demonstrated ability to troubleshoot process issues using structured problem-solving methods.
- Ability to read and interpret customer drawings, specifications, tolerances, and assembly requirements.
- Strong attention to detail and commitment to quality.
- Strong written and verbal communication skills.
- Ability to work effectively in a cleanroom or lab environment.
Preferred Qualifications
- Experience with Palomar die bonders, wire bonders, vacuum soldering systems, or similar back-end assembly platforms.
- Experience with equipment from companies such as ASMPT, Kulicke & Soffa, Besi, Datacon, Finetech, F&K Delvotec, Hesse, West Bond, AIXEMTEC, ficonTEC, or similar.
- Experience in high-mix / low-volume contract manufacturing, process development, NPI, or engineering services.
- Familiarity with:
- Pattern recognition and machine vision
- Precision placement
- Epoxy dispense
- Eutectic or solder attach
- Wire pull / shear testing
- Optical inspection
- Metrology and dimensional verification
- Experience supporting customer-facing engineering projects.
- Familiarity with root cause analysis, DOE, SPC, FMEA, or structured problem-solving methods.
- Experience working with customer-supplied materials or consigned inventory.
Key Competencies
The successful candidate will demonstrate:
- Strong hands-on equipment aptitude
- Practical understanding of back-end semiconductor assembly processes
- Ability to connect process results to equipment setup and material behavior
- Clear technical communication
- Strong ownership and follow-through
- Early escalation and risk awareness
- Comfort working directly with customers
- Ability to operate in a fast-paced, high-mix environment
- Willingness to document, standardize, and share process knowledge
What Success Looks Like
Within the first 6–12 months, a successful Process Engineer II will:
- Independently execute customer projects using ASD packaging equipment with limited oversight.
- Set up and troubleshoot at least one core back-end process area, such as die attach, wire bonding, or pick-and-place.
- Communicate clearly with customers and internal stakeholders regarding project status, risks, and technical findings.
- Reduce engineering bottlenecks by owning projects from setup through completion.
- Produce clear documentation that improves repeatability and helps future engineers build on prior work.
- Demonstrate strong judgment in balancing quality, timeline, and customer expectations.
If you are interested in this position, please email HR at resumes@bonders.com.