The Frequently Asked Questions Mini-Series: 9000 Wedge Bonder Part Two

This is the last blog of our mini-series which discusses the frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the ...

Posted by Katie Finney on July 21

Eutectic Die Attach – A Useful & Often Necessary Process

For applications that have strict temperature parameters, eutectic die attachment is typically the best solution. Epoxies and other fluid ...

Posted by Janine Powell on December 16

Hughes Aircraft Industrial Products Division History Part 2: Pulsed Heat Technologies

This second installment of the history overview of the Hughes Aircraft Industrial Products Division series will cover developments of ...

Posted by Janine Powell on April 22

The ABCs of LEDs – Wafers, X-axis & X-ray

W – Wafer While the microelectronics industry is working hard to develop low-cost LED packaging methods—such as with thermally and ...

Posted by Janine Powell on January 22

The ABCs of LEDs – Quality & Reliability

When discussing the hot topic of LEDs, quality and reliability become two major factors. Without either of these qualities, LEDs would have ...

Posted by Janine Powell on December 18

共晶或环氧？生产吞吐量的注意事项 (Eutectic or Epoxy? Considerations for Production Throughput)

[For the English version, click here.] ...

Posted by Janine Powell on November 26

The ABCs of LEDs – Epitaxy, Efficacy, Film, & Flux

The first week of this series discussed Attach Process and Boule, and last week talked about Conductivity and Defects. This week we will ...

Posted by Janine Powell on October 30

The ABCs of LEDs – Conductivity and Defects

In this series, we are exploring the ins and outs of LEDs. Last week, we began our LEDs series with “A - Attach process” and “B - Boule”. ...

Posted by Janine Powell on October 23

The ABCs of LEDs – Starting with “A”

Light emitting diode (LED)-based applications are growing, and cover a broad range of markets. LEDs are bright, efficient, and quick to ...

Posted by Janine Powell on October 16

Mixed Attachment Technology in RF & Optoelectronic Packages

The increasingly densely populated and higher power levels of RF & Optoelectronic packages are creating unique challenges for assembly ...

Posted by Janine Powell on April 23