Solutions and processes

Delivering THE Total Solution

We’ll help you become the leader in your market by providing state-of-the-art assembly services that are capable of ultra-high precision die attach, wire bonding, ribbon bonding, and die sorting.
3880 Die Bonder
Assembly Services lab

Turnkey die attach and wire bonding services. Applications from lens attach and VCSEL placement to optoelectronic/photonics packages using high precision die attach. This process is performed in our laboratories in California, which are fully outfitted for micro-optoelectronic packaging:

  • Class 1000-10000 clean room spaces
  • Secure work areas with ITAR certification
  • Temperature, humidity, ionization control
  • Electro-static discharge (ESD)
  • Ideal for shipping and receiving
  • Secure warehouse
  • IP confidentiality

Die Attach

  • Epoxy Die Attach
    • Conductive
    • Non-conductive
    • UV cure
    • Snap cure
    • Anisotropic adhesive
  • Eutectic Die Attach
    • Preform
    • Pre-deposited / Back-side metalized
    • Solder paste
    • Void-free soldering, flux-free attach
  • High Accuracy Component Placement
  • Flip Chip
  • Thermo-Compression
  • Glass Sealing
  • Wafer (up to 12”)
  • Deep Access

Machines used: Palomar 3880, 6500 Die Bonders; SST 5100 Vacuum Reflow System

Wire Bonding

  • Gold Wire, Gold Ball Bonding
  • Gold Ball Bumping
  • Stud Bumping
  • Ultrasonic wire bonding
  • Wedge Bond, Gold Wedge Bonding
  • Aluminum Wedge Bonding
  • Ribbon Bonding
  • Deep Access Wire Bonding
  • TAB Bonding

Machines used: Palomar 8000i, 9000 Wire Bonders

Additional Capabilities

  • Hermetic Package Sealing
  • High Vacuum MEMS Packaging
  • Die Sorting
  • Wire Pull Testing
  • Die/Shear Testing
  • Plasma Cleaning: single gas, multiple gas, argon, oxygen, forming gas
  • Encapsulation
  • Video Measurement
  • Scanning Acoustic Microscope (SAM)
  • Scanning Electron Microscope 

*Consigned test equipment floor space for special applications available

Machines used: Royce Tester, Royce Die Sorter, SST Vacuum Reflow, SCI Plasma Cleaning, Keyence VHX-1000, Nikon VMR, Sonix CSAM

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Assembly Services

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Data Sheet White@2x.png 3880 Die Bonder
Data Sheet White@2x.png Technical Papers & eBooks
Data Sheet White@2x.png 8000i Wire Bonder
Data Sheet White@2x.png Process Development Services