Low Profile Reverse Bond to Die

In a low profile reverse bond to a die, stand-off-stitch is used to place a ball bump on the die pad and then stitching onto t he ball bump. A second ball bump is used on the pad as a fulcrum to keep the wire from sagging onto the die edge.

Requirements:
8000i Wire Bonder
Tailess Bump Mode
Standard Wire Loop Mode 

Specifications:
Wire = 1 mil (25.4 um) 99.99 Au
Substrate = Al pad
Temperature = 150 C