Last week was the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The 47th Symposium on Microelectronics covered three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability. IMAPS 2014 featured 6 technical tracks that spanned three days: Interposers & 3D Packaging; The Future of Packaging; Advanced Packaging; Interconnects & Assembly; Materials & Processes; Modeling, Design, & Test; and Special Sessions on 3D & Embedding and Reliability. The 2014 Symposium also featured an Interactive Industry/Student Poster Session, Panel Discussion on The Future of Packaging, as well as 6 keynotes from Qualcomm, IBM, IPDiA, Jawbone, and Micron, and many more.
Conference attendees were able to observe demonstrations of the Palomar Technologies 8000i Wire Bonder/Ball (Stud) Bumper with Intelligent Interactive Graphical Interface® (i2Gi®).
See our press release for the show here.
Check out the video below for a recap of the show: