Maximize Throughput with the Push-Pull Handler

Handlers are bonder options that can bring great value and efficiency to your assembly process. The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions such as fully automated hybrid production lines. Because the machine is so versatile—and because its installed base is so large—new developments are continually reached and well documented for odd forms or deep packages, improved yields, and improved overall package quality for greater efficiency and reduced costs.

Push-Pull Handler

The 8000i Push-Pull Handler allows full utilization of the large work area of the bonder, 6.0” x 12.0”, by splitting it into two separate loading areas, each 6.0” x 6.0”. As the operator loads each side separately, the bonder is able to run without interruption, thus maximizing throughput. Either a single part or multiple parts can be loaded into trays off-line and introduced to the bonder while it is in operation on the adjacent work space. Once a tray is loaded, the parts are raised, clamped (mechanically or with vacuum), and preheated while the other side is being bonded. Machine bond time is near 100% of on-time. 

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Advantages of Push-Pull Handlers

Overall, there are three key advantages of a handler: the presence of a handler reduces contamination, cuts the cost of operators providing lower labor costs, and increases quality of product due to the elimination of human interference or error.

In the standard configuration, the 8000i Wire Bonder allows operators to load a single tray of parts into the work envelope for automatic bonding. Before bonding a second tray of parts, the operator must remove the completed tray and load a new tray of un-bonded parts. When an assembly process does not necessitate an inline handler to receive parts from an up-line machine, a push-pull handler can offer the same benefit of quickly loading parts, increasing the throughput of parts.

In performing complex microelectronics packaging, extreme precision and accuracy are imperative, in addition to repeatability and quality. Only an automated robot can handle an application at 1.5micron, 3-sigma output requirements. Because robots are automated and can perform exactly to your specifications each time, they are faster, more efficient, and create a higher quality package, thus ultimately lowering the cost of precision. This is why the elimination of major human interference or error is one of the greatest advantages of not only utilizing push-pull handlers, but also utilizing automation.

Watch the Video: Automated RF Assembly with Handlers on the 8000 Wire Bonder to see the standard configuration.

 Download the 8000i Wire Bonder data sheet for more information:

               8000i Data Sheet
8000i wire bonder, ball bumper, i2Gi

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Katie Finney
Marketing Specialist
Palomar Technologies, Inc.