System in a Package (SiP)
System in a Package (SiP) technology was designed for multiple advanced packaging applications to create solutions that can be customized depending on the need of the user. A system-in-a-package (or system in package) is a number of integrated circuits enclosed in a single package or module.
No two customers are alike. There are differences in microelectronic challenges as well as differences in concepts and desired end results.
- Lower cost of ownership (due to more efficient ICs and multiple ICs in one package)
- Reduced cycle times for system design
- Higher levels of integration
- Smaller size with increased functionality (compared to individually packaged ICs)
- Greater flexibility in product development
Applications for System in a Package:
How it Works
The SiP performs all or most of the functions of an electronic system. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder or gold ball bumps are used to join stacked chips together. SiP dies are stacked vertically, unlike slightly less dense multi-chip modules, which place dies horizontally alongside one another. SiP connects the dies with standard wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with conductors running through the die utilizing “through silicon vias” (TSV).
An example SiP can contain several chips—such as a specialized processor, DRAM, flash memory—combined with passive components—resistors and capacitors—all mounted on the same substrate. This means that a complete, functional unit can be built in a multi-chip module so that few external components need to be added to make it work. This is particularly valuable in space-constrained environments as it reduces the complexity of the printed circuit board and overall design.