Microelectronic Mechanical Systems (MEMS)

Contract SMT Assembly LED Laser Print Head Array AuSi / AuSn Eutectic Die Attach

 

Microelectronic Mechanical Systems (MEMS) are becoming more and more common; the technology enables greater power and supreme complexity in a small, single system. MEMS technology is essentially very micro machines, small mechanical devices driven by electricity.MEMS device

MEMS are found in the following:

  • Inkjet printers
  • Accelerometers
  • MEMS gyroscopes
  • Pressure sensors: silicon, car tire and blood pressure
  • Displays with several hundred thousand micro mirrors
  • Optical switching in data communications
  • Bio-MEMS
  • MEMS Optical Switches

MEMS devices typically combine electronic circuitry with mechanical structures to produce different outcomes. With optical switches, the key mechanical components are MEMS-based micro-machined mirrors. These are created with silicon chips using well-established, very-large-scale integration and complementary metal-oxide semiconductor (CMOS) foundry processes.

MEMS Optic Devices
The general attributes of MEMS Optic Devices are that they are small and inexpensive, fabricated like an IC, easily scalable into a large number of devices, can be integrated with analog and digital circuits, are robust and long-lived, provide extraordinarily flexibility and are a very good match for optics.

Palomar Technologies Solution

AuSn solder is an excellent option when considering die-attach materials for applications requiring high-strength, high-temperature stability, precision placement, clean materials, and ease of use. Advances in packaging equipment have increased the throughput on this bonding, making it a much more commercially viable solution for applications ranging from small volume MEMS assemblies to high-volume wireless RF packaging.

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