Fine Pitch Devices

Wedge Bonding Emulation Download the 8000i Data Sheet Multipurpose Wire Bonder Get Training from Engineers


Fine pitch devices are those requiring close proximity to other wires, diodes or any other aspect of a device package. Fine pitch applications usually require a more sophisticated or capable wire bonder. Factors at work include tight control of bonding force, ultrasonic energy level, and the looping capability of the wire (reverse loops, long loops, short loops, low loops). Looping capability with fine pitch wires becomes an important consideration due to the greater possibility of loop sway.

Palomar Technologies Solution

The 8000i Wire Bonder features true orthogonal bonding, consistently producing high quality bonds at varying surface heights over a 20mm range.

fine pitch wire bond






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