Ball Grid Array (BGA)

Improved Wire Bond Reliability Telecom Tool Kit Contract Assembly in the USA

 

ball grid array (BGA)

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGAs offer three main advantages:

  1. High density. BGAs are a solution for production of miniature packages for an integrated circuit with hundreds of pins. BGAs do not have the common issue of adjacent pins bridging together when the solder is factory-applied to the package.
  2. Heat conduction. BGA packages with discrete leads (i.e. packages with legs) are the lower thermal resistance between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.
  3. Low-inductance leads. BGAs, with the very short distance between the package and the PCB, have low inductances and therefore have far superior electrical performance to leaded devices.

 

Palomar Technologies Solution

Palomar Technologies Assembly Services (“Assembly Services”) offers unique assembly methods supporting flux-less Micro Ball Grid Array (BGA) solder reflow. More specifically, Assembly Services has recently developed a solder reflow process for SAC405 Micro BGAs without the need for a flux.

Assembly Services uses mixed technologies—such as chip and wire—using microelectronic assembly equipment in a clean room environment. This allows for the process of all Micro BGA components the ability to then move to traditional die attach and wire bond processes for active components not available in a package format.

Click here to learn more about flux-less micro BGAs.

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