RF Wire Bonding & Die Attach Surface Mount Technology (SMT) HB Matrix LED Assembly   Automated Eutectic Die Attach

Solving Your Packaging Challenge

customizing machine for microelectronic applicationsBy participating in a pre-quotation study with the customer, Palomar Technologies applications engineers help clarify and define the appropriate equipment or service needed. Once equipment selection is made and manufacture is complete, the apps engineer can demonstrate the chosen machine’s capabilities using a customer’s parts and programs.

  Process Development Services

Tell Us Your Challenge

wire bonds

Palomar Technologies provides solutions for a wide variety of application requirements for first level interconnect of microelectronic packages. Its fundamental capabilities for large area, high-precision and high-performance assembly make Palomar Technologies a supplier of choice.

Process capabilities listed are the foundation of our business for equipment and contract assembly.

Wafer Scale Packaging
Optoelectronic Packaging
Laser Diode Packaging
Wedge Bonding
Eutectic Die Bonding
Epoxy Die Bonding
Gold Stud Bumping / Gold Ball Bumping
RF Device Packaging
Power Amplifiers Packaging
Power Transistor Packaging

These capabilities are applied to the aerospace and defense, medical, telecommunications and consumer high technology markets.