If you couldn’t meet us in Bordeaux, join Palomar Technologies for the ECOC Exhibition Virtual Catch up from November 1 – 3, 2021. Request a meeting during conference hours or leave a message for us 24/7 during the catch up days and we’ll make sure to connect with you to answer any questions. Learn how Palomar has the best solutions for photonics packaging with our Palomar 3880-II Die Bonder, the Palomar 8100 Wire Bonder and the SST 5100 Vacuum Reflow Oven.

Register today:  https://www.ecocexhibition.com/register/