Wire bonding is the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated circuit (IC) packages, RF microwave packages, and optoelectronic packages. Types of primarily wire bonding are ball-and-stitch bonding, ball bumping, wedge bonding and ribbon bonding.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder driven by voice coil technology in the bond head. This machine has interchangeable 45-60° and 90°deep access wedge clamps and operates across a single large 304 x 152 mm work area. As the entire bond head mechanism rides on theta, users realize excellent wire tension, a shorter wire feed path and inherent prevention of twisting of wire and ribbon, and better overall process control.

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The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it’s suited for many aspects of packaging and component assembly, including complex hybrids, MCMs, and high-reliability devices.

When it comes to wire bonding, what method should you use: ball bonding or wedge bonding? Why would a process engineer choose a wedge bonder over a ball bonder or vice versa? Check out this blog post to compare the two.