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Palomar Technologies Exhibits at SEMICON West 2014 Showcasing Wire Bond Demos

Posted by Katie Finney on Tue, Jul 01, 2014

Carlsbad, CA – July 1, 2014 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced product demos at booth #5952 at SEMICON West 2014 on July 8-10 at the Moscone Center in San Francisco. The 8000i Wire Bonder with Intelligent Interactive Graphical Interface® (i2Gi®) will be showcased through live demonstrations, as well as other leading edge packaging solutions.

The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

One of the main areas where Palomar has been focusing is optoelectronic assemblies—many of which have been VCSEL & PD based optical Tx and Rx systems using individual components or arrayed components, typically 1x4 arrays. Palomar divides these assemblies into two classes by accuracy requirements. “The 6500 Die Bonder satisfies markets requiring less than 5um placement. The 3800 Die Bonder satisfies markets requiring greater than 5um placement accuracy. We have also been placing the molded lenses for these assemblies, either single or arrayed,” states Applications Manager and Sr. Scientist, Daniel Evans.

An application example of multi-channel communication that Palomar is currently working on is the Active Optical Cable (AOC):

Photo credit: Luxtera

Photo credit: Finisar

Photo credit: Zarlink


New Features at SEMICON West                                                                         

Over 20,000 visitors are currently registered for the show, and new features have been included this year—ensuring that this will be an extremely well attended and exciting show. Amongst the added programs to SEMICON West this year are The Semiconductor Technology Symposium and the Sustainable Manufacturing Forum. These are meant to provide attendees the opportunity to dig deeper into technical subject matters in a quieter, more intimate environment.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach, wire bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly, and micron-level component attachment. Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world. For more information, visit


Claudia Salerno
Marketing Communications Manager
Palomar Technologies, Inc. | 760.931.3681

Topics: 3800 die bonder, Announcements, 8000i Wire Bonder, 6500 die bonder, SEMICON West 2014

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