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Palomar Technologies Presents Sub-5um Die Attach Placement Accuracy Webcast

Posted by Palomar Technologies MarCom Team on Tue, Jun 12, 2012

Carlsbad, CA – June 12, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that the company can support high-precision die attach to less than 5µm placement accuracies.

“As the trend to build smaller electronics pushes the limits of semiconductor packaging abilities, the need for high-accuracy and high-precision component placement often presents a challenge in itself,” stated Donald Beck, Palomar Technologies Assembly ServicesTM General Manager. “We are able to support [application dependent] requirements for ultra-high placement accuracies on our eutectic/epoxy 3800 Die Bonder and 6500 Die Bonder systems.”

The ultra flexible 3800 Die Bonder is designed for fully automatic, precision microelectronics assembly. The tightly regulated,computer-controlled work cell can perform up to three channels of adhesive dispense, component placement, eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. The 3800 Die Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions.

The 6500 Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless and medical applications. This eutectic die bonder is designed for fully automatic precision component assembly—even up to 1.5µm placement accuracy (application dependent)—making component assembly practical and cost effective. Wafer Scale Packaging (WSP) eutectic die attach on the 6500 Die Bonder provides customers with a complete microelectronic solution for P-side down laser diode attachment (die-to-wafer), a pulsed heat pick tool for 80/20 Au/Sn pulsed reflow attachment, a wafer stage with steady state heating, and waffle or gel pack presentation of laser diode applications.

Mr. Beck is presenting a 30-minute live webcast on June 13 at 12:00pm Eastern Time, discussing new developments for ultra high-precision component packaging: “<5micron Placement Accuracy" target="_self">High-Reliability Component Attachment Process for <5micron Placement Accuracy ".

The webcast will cover a process solution for <5µm component attach" target="_self">automating <5µm component attach specific to organizations requiring high-reliability device packaging. In this webinar, Mr. Beck will cover methods that have been proven through real-world experiences related to the high-reliability microelectronics industry. Joining Mr. Beck will be Mr. Zeger Bok (Sr. Application Engineer) and Mr. Daniel Martinez (Assembly Services Lab Manager & Manufacturing Engineer) for live Q&A after the formal presentation.

Register now for the live webcast, presented on June 13 at Noon Eastern Time. 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Topics: 3800 die bonder, Announcements, device design, die bonders, eutectic die attach, eutectic soldering process, die bonding, gold tin eutectic die attach, 6500 die bonder, eutectic process, die bonder, IMAPS, eutectic, eutectic tutorial, gold tin die attach, placement accuracy of microelectronic components

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