Palomar Technologies' 3880 Die Bonder Wins the NPI Award for Bonders

Posted by Katie Finney on Tue, Mar 29, 2016

Circuit Assembly announced on March 15, 2016 that Palomar Technologies’ 3880 Die Bonder won the New Product Introduction (NPI) Award for Bonders. Circuit Assembly’s NPI Awards recognize the leading new products for electronics assembly during the past 12 months.  An independent panel of practicing industry engineers selected the recipients and then presented the awards during a ceremony at the IPC Apex Expo in Las Vegas.

The judges evaluated the submitted entries based on the following criteria:3880.jpg

  • Creativitiy and innovation
  • Compatibility with existing technology
  • Cost-effectiveness
  • Design
  • Expected reliability
  • Flexiblity
  • Expected maintainability/ease of repair
  • Performance
  • User-friendliness
  • Speed/throughput

The new 3880 Die Bonder, the latest addition to the Palomar Technologies suite of die attach solutions, combines fine placement accuracy, fast tool indexing time, excellent tool planarity, and position precision making it the most advanced die bonder platform available today. It features a new fully integrated Z-Theta bidirectional bond head enabling improved reliability and uniformity across a wide range of applications. 

The new high precision bidirectional turret wheel ensures planarity of all pick tools without the need for individual leveling. This allows rapid tool changes without impacting process set up. Its large work envelope is ideal for a versatile automated die bonder capable of handling many different part types, presentation options, and application processes.3880_Bond_Head.pngAmong the innovations on this cutting-edge machine is the ability to hit Palomar's best accuracy and repeatability specs over a wider range of applications and conditions. This bonder is built upon a rich set of pick and place features, options, and capabilities. A complete redesign of the bond head incorporates a voice coil actuator, allowing for improved gram bond forces, improved linearity, and the bidirectional tool indexing which comes standard.

In addition, the 3880 Die Bonder is already compatible with Palomar’s VisionPilot® vision system. It utilizes advanced geometric pattern matching technology to reliably and accurately locate parts. Even under the most challenging conditions, this exclusive Palomar Technologies software can significantly reduce or eliminate fixturing requirements and costs. For locating parts or features, VisionPilot provides the maximum inspection yield and reliability available in a vision system.

Download the following resources for more information:

3880 Data Sheet Buyer's Guide eBook VisionPilot Data Sheet
3880 die bonder Top Considerations When Purchasing A Bonder VisionPilot Data Sheet



Media Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc. | +1 760.931.3680

Tags: Awards, NPI Awards, VisionPilot, 3880

Visit Palomar Technologies at OFC 2016

Posted by Katie Finney on Tue, Mar 22, 2016

Carlsbad, CA – March 22, 2016 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced they are exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) at booth #1814 on March 22-24 in Anaheim, CA. Stop by their booth to learn more about solutions from Palomar Technologies and SST International.

With over 13,000 attendees and over 65 countries represented, OFC is the largest global conference and exposition for optical communications and networking professionals. According to OFC, some of the exhibition’s features this year are:

  • Exhibits from major international companies. Exhibitors include network and test equipment vendors, systems and component manufacturers, fiber cable and specialty fiber manufacturers.
  • Two Exhibit Hall theaters of business programming, featuring presentations by experts from major global brands and key industry organizations.
  • Local Representation from more than 100 California-based companies on the exhibit floor.

Palomar Technologies Solutions
Palomar Technologies’ Assembly Services is a perfect-fit solution for optoelectronic packaging without investing in capital equipment. This minimizes the customer’s project risk and accelerates time-to-market while maintaining the strong and dependable support of a trusted partner, ensuring a sustainable competitive advantage.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit


Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc. | +1 760-931-3680



Tags: Announcements, Assembly Services, OFC

Palomar Technologies Performs Live Demonstrations at SEMICON China 2016

Posted by Katie Finney on Tue, Mar 08, 2016

Carlsbad, CA—March 8, 2015—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced they will be present at SEMICON China March 15-17, 2016 at the Shanghai New International Exhibition Center. SEMICON China “connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China”.

Palomar Technologies is looking forward to showcasing and providing live demonstrations of their 9000 Wedge Bonder and their new 3880 Die Bonder. To view the live demonstrations and learn more about Palomar, stop by the Be First Technology Co., Ltd. booth located at booth #4667. You can also learn more about Palomar Technologies by stopping by the Beijing Asia Science & Technology Co., Ltd booth located at booth #2443.

Palomar Technologies' new 3880 Die Bonder features a fully integrated Z-Theta bidirectional bond head enabling reduced maintenance and uniformity across a wide range of applications. The new machine’s combined fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Presentation options include wafer, waffle/gel pak, tape and reel, boat, and carriers. Custom stages are also available.3880_Bond_Head.png

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. The 9000 Wedge Bonder offers ultimate control and flexibility to change from a 45-60° wire feed range to 90° deep access with only a clamp change on the robust, theta-rotation bond head. No need for multiple expensive bond heads! Modern Wedge Bonding eBook

 The Palomar Asia office may be contacted online:

Download these resouces for more information:

3880 Data Sheet Epoxy Die Attach eBook 9000 Data Sheet
3880 die bonder epoxy die attach,daubing, epoxy dispensing, high-precision component attach 9000 Wedge Bonder data sheet


Tags: SEMICON China, 9000 Wedge Bonder, 3880 Die Bonder