Palomar Technologies’ President and CEO, Bruce Hueners, is an EY Entrepreneur of The Year® 2015 Award Finalist

Posted by Katie Finney on Tue, May 26, 2015

Carlsbad, May 26, 2015 – EY today announced that President and Chief Executive Officer, Bruce Hueners of Palomar Technologies is a finalist for the EY Entrepreneur Of The Year 2015 Award in San Diego. The awards program recognizes entrepreneurs who demonstrate excellence and extraordinary success in such areas as innovation, financial performance and personal commitment to their businesses and communities.  Bruce Hueners was selected as a finalist by a panel of independent judges.  Award winners will be announced at a special gala event on June 18, 2015 at The Fairmont Grand Del Mar. 

"I am truly honored by this recognition and want to particularly express gratitude to my fellow employees at Palomar for their diligence, perseverence and teamwork, which made this all possible," says Bruce Hueners.

Now in its 29th year, the program has expanded to recognize business leaders in more than 145 cities in more than 60 countries throughout the world. 

Regional award winners move forward to compete for the EY Entrepreneur Of The Year National program.  Award winners in several national categories, as well as the EY Entrepreneur Of The Year National Overall Award winner, will be announced at the annual awards gala in Palm Springs, California, on November 14, 2015. The awards are the culminating event of the EY Strategic Growth Forum®, the nation’s most prestigious gathering of high-growth, market-leading companies.

Sponsors
Founded and produced by Ernst & Young LLP, the EY Entrepreneur Of The Year Awards are sponsored nationally by the Ewing Marion Kauffman Foundation and SAP America.

In San Diego, sponsors include: Barney & Barney (a Marsh & McLennan Agency LLC Co.), Union Bank, The Daily Transcript, Merrill Datasite, Scherzer International, Cresa, Chase Bank, and Allison+Partners.

Contact information
To receive more information, contact: Kathy Beckman at (949) 437-0236 or kathy.beckman@ey.com.


About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach, wire and wedge bond equipment, and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About EY Entrepreneur Of The Year®
EY Entrepreneur Of The Year is the world’s most prestigious business award for entrepreneurs. The unique award makes a difference through the way it encourages entrepreneurial activity among those with potential and recognizes the contribution of people who inspire others with their vision, leadership and achievement. As the first and only truly global award of its kind, Entrepreneur Of The Year celebrates those who are building and leading successful, growing and dynamic businesses, recognizing them through regional, national and global awards programs in more than 145 cities in more than 60 countries. Follow news on Twitter @EY_EOY #EOYSD.

About EY
EY is a global leader in assurance, tax, transaction and advisory services. The insights and quality services we deliver help build trust and confidence in the capital markets and in economies the world over. We develop outstanding leaders who team to deliver on our promises to all of our stakeholders. In so doing, we play a critical role in building a better working world for our people, for our clients and for our communities.

EY refers to the global organization, and may refer to one or more, of the member firms of Ernst & Young Global Limited, each of which is a separate legal entity. Ernst & Young Global Limited, a UK company limited by guarantee, does not provide services to clients. For more information about our organization, please visit ey.com.

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Media Contact
Claudia Salerno

Marketing Communications Manager
Palomar Technologies, Inc.
csalerno@bonders.com | +1 760-931-3681

Palomar Technologies to Exhibit at the 2015 International Microwave Symposium

Posted by Katie Finney on Tue, May 19, 2015

Carlsbad, CA – May 19, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they will be one of over 550 exhibitors at the International Microwave Symposium (IMS) at booth #2517 on May 19-21 in Phoenix, Arizona. IMS is “the premier annual international meeting for technologists involved in all aspects of microwave theory and practice”. IMS stated, “It is the synergy of the Exhibition in conjunction with the Technical Symposia that makes Microwave Week the premiere international gathering for everyone involved in technologies associated with RF, microwave, millimeter wave, and THz frequencies”.

Automated wire bonders were introduced in the early 1980s. At that time, the majority of interconnects were made using aluminum wire. As the need for high reliability increased, gold wire became more common. As package densities increased, wire interconnect bond pitches decreased. The initial solution to fine pitch was wedge bonding because the wedge tool design allows wires to be bonded in close proximity (side-to-side).9000_pic17_hi_res

The RF and microwave markets are characterized by lower volume and higher mix when compared to semiconductor packaging. This requires different levels of manual and automatic assembly process steps depending on product and manufacturing maturity. Suppliers can help customers through the various stages of manufacturing automation by providing manual, semi-automatic, and fully automatic islands and lines of equipment and process.

Although there is continued effort in the semiconductor packaging industry to reduce package size along with the never-ending pursuit of cost savings, there remain a significant number of applications requiring a wildly different set of capabilities for die and wire bonding.

wedge_emulation

Wedge vs. Ball Bonding

Download "RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies" to take a deeper look at varying die attach and wire bonding requirements for emerging applications in the RF and microwave markets. The paper discusses three case studies:

  1.     RF-SOE Product (High Accuracy Die Bond + Semi/Automatic Wire Bond)
  2.     Optoelectronic Printer Product (Ultra Accuracy Die Bond)
  3.     High Brightness LED Matrix Product (High Accuracy Die + Semi/Auto Chain Wire)

About Palomar Technologies:

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information:

RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies 9000 Data Sheet
RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies 9000 Wedge Bonder data sheet

 

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Katie Finney
Marketing Specialist
Palomar Technologies, Inc.

Tags: RF Packaging, 8000i Wire Bonder, microwave applications, International Microwave Symposium (IMS), 9000 Wedge Bonder

Palomar Technologies Introduces the 9000 Wedge Bonder to Germany at SMT Hybrid Packaging 2015

Posted by Katie Finney on Tue, May 05, 2015

Carlsbad, CA – May 5, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, will be introducing the 9000 Wedge Bonder to Germany at the 2015 SMT Hybrid Packaging conference in Nuremberg, Germany on May 5-7. They will be showcasing the 9000 Wedge Bonder as well as their 8000i Wire Bonder at their booth located in hall 7A, booth 7A-521.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering control and flexibility. The 9000 features a large 12”x6” work area and the ability to easily change from a 45-60° wire feed range to 90° deep access. The quality control enabled by the 9000 is unparalleled, with real-time bond monitoring and process control software as well as a robust, low maintenance bond head. With the 9000 there is no need for an expensive bond head change, as the wire clamps are easily replaceable and adjustable.PT5-White

There are seven strategic components to the 9000 Wedge Bonder that help customers achieve modern wedge bond requirements:

  •          Large work area
  •          Inline factory automation
  •          Advanced user control
  •          Bond data miner
  •          High-speed wire bonding
  •          Wire feed clamp versatility
  •          High-precision

Palomar Technologies pioneered the first automated fine wire wedge bonders in the 1980s and today carries the technological legacy into the industry’s most advanced fine wire wedge bonder on the market.

Operational Features for Control and Precision

The Intelligent Interactive Graphical Interface® (i2Gi®) is an advanced GUI software feature implemented on the 9000 Wedge Bonder, and is an exclusive Palomar Technologies technology. i2Gi offers the required management tools for modern wedge bonding, from part design and development, to process validation, and finally to intuitive operations control. i2Gi was designed for 9000 Wedge Bonder operating technicians to work smarter, faster and with more control.

The natural navigation flow and interactive live graphical display of i2Gi lets bonder program developers and operators experience real-time bonding and part quality validation. i2Gi technology supports advanced wedge bond control through command tools which work in concert to provide a dynamic and intuitive user experience. 

Process Advantages

The 9000 Wedge Bonder addresses a wide range of fine wire wedge bond applications including disk drives, large complex hybrids, MCM power connections, ribbon bonding, low profile wire bonds, running stitch interconnects, and fine pitch devices. Some process advantages of the 9000 Wire Bonder include:

SMT
  •          Providing various loop form functions
  •          Highly regulated constant wire length
             as well as loop height
  •          Individual loop shapes
  •          Loop length range from
             70um to 20mm.

The 9000 Wedge Bonder also incorporates Bond Data MinerTM which is an all-inclusive and centralized data management and analysis system. This is a powerful tool to improve yield and utilization.

Delivering What Programmers Desire

Modern wedge bond requirements demand an automated, large bonding area system with scalability to increase production capacity without limiting performance. In order to achieve best efficiency at lowest cost, programmers and operators need relevant and real-time production feedback from their equipment.

With the 9000 Wedge Bonder, lab managers are able to have peace of mind that their bonder is fully supported by a highly trained team of field service and process development consultants.

9000 Data Sheet i2Gi Data Sheet
9000 Wedge Bonder data sheet i2Gi, intelligent interactive graphical interface, modern wire bond control software

 

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Media Contact
Claudia Salerno
Marketing Communications Manager 
Palomar Technologies, Inc.
csalerno@bonders.com | +1 760-931-3681

 

Tags: i2Gi, 9000 Wedge Bonder