Palomar Technologies to Exhibit at the Optical Fiber Communication Conference 2015

Posted by Katie Finney on Tue, Mar 24, 2015

Carlsbad, CA – March 24, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they are exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) at booth #420 on March 24-26 in Los Angeles, CA.

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With over 13,000 attendees and over 65 countries represented, OFC is the largest global conference and exposition for optical communications and networking professionals. Some of the hot topics for this year’s conference include:

  • Digital signal processing for optical fiber communication systems
  • Amplification, fiber, and multiplexing techniques for capacity
  • Cloud and data center networking
  • Digital signal processing for optical fiber communication systems

Optoelectronic Packaging

OFC will also be having comprehensive peer reviewed presentations in key topic areas including Optoelectronic Devices. Three equally important concerns for optoelectronic devices are package design, controlled assembly processes and meeting critical assembly alignment and position tolerances. Palomar Technologies manufactures and services highly advanced microelectronic packaging systems, excelling in advanced processes, high purity, exceptional heat transfer and precision.

Palomar Technologies Solution

Palomar Technologies' Assembly Services are a perfect-fit solution for optoelectronic packaging without investing in capital equipment. This minimizes the customer’s project risk and accelerates time-to-market while maintaining the strong and dependable support of a trusted partner, ensuring a sustainable competitive advantage.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information: 

 

3800 Data Sheet 6500 Data Sheet 8000i Data Sheet
3800 Die Bonder Data Sheet 6500 Die Bonder Data Sheet 8000i wire bonder, ball bumper, i2Gi

 

 

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Contact

Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

 

Tags: 3800 die bonder, 8000i Wire Bonder, 6500 die bonder

Palomar Technologies’ CTO to Present at SEMICON China 2015

Posted by Katie Finney on Mon, Mar 16, 2015

Carlsbad, CA – March 16, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced today they are exhibiting at SEMICON China 2015. SEMICON China is celebrating its 27th year anniversary and will be held at the Shanghai New International Exhibition Center on March 17-20.

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Dan Evans, Palomar Technologies’ Chief Technical Officer, will be presenting his technical paper titled “Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies” at this year’s SEMICON China conference.

Mr. Evan’s technical paper discusses both VCSEL and EEL technologies from a packaging architectural view with case studies showing high accuracy pick and place of the laser die, photo detector, and lens attachments. He also presents example cases to show the challenges and solutions to high accuracy die attach active optical cables. The paper is applicable to process engineers and managers who currently, or plan to, assemble Active Optical Cable transceivers or other similar packages using high accuracy pick and place systems. 

In addition to Dan Evan’s presentation of his technical paper, Palomar Technologies is also looking forward to showcasing their 9000 Wedge Bonder as well as performing live demonstrations of their 3800 Die Bonder and 8000i Wire Bonder at this year’s SEMICON China.

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90° deep access on a single large work area. There are 7 key differentiators to the 9000 Wedge Bonder, which help customers achieve modern wedge bond requirements.  
7 key differentiators

The ultra-flexible 3800 Die Bonder is designed for fully automatic, precision microelectronic assembly. The 3800 is versatile, powerful and can provide specialized functions in addition to its primary functions.

Palomar Technologies’ 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. 

The Palomar Asia office may be contacted online: www.palomartechnologies.com/contact-palomar-technologies-asia/. 

Download these resouces for more information:

9000 Data Sheet 3800 Data Sheet 8000i Data Sheet
9000 Wedge Bonder data sheet 3800 Die Bonder Data Sheet 8000i wire bonder, ball bumper, i2Gi

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Media Contact
Claudia Salerno
Marketing Communications Manager 
Palomar Technologies, Inc.
csalerno@bonders.com| +1 760-931-3681

Tags: 3800 die bonder, 8000i Wire Bonder, SEMICON China, 9000 Wedge Bonder

Palomar Technologies Acquires SST International

Posted by Katie Finney on Tue, Mar 03, 2015

Carlsbad, CA – March 3, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems has acquired SST International, a turnkey supplier of vacuum and pressure furnaces for soldering, brazing, glass-sealing and wafer bonding of microelectronic packages and components.  SST International will complement Palomar’s existing line of wire and die bonders to provide customers the premier “one-stop shop” for precision assembly and hermetic packaging of electronic components.

“SST International will leverage Palomar’s established market presence and global network to provide customers with unmatched equipment capability and process know-how”, said David Muhs, President of SST International.  “This is an exciting time for SST and our customer base as we find tremendous opportunities for growth with the expansion of the company's portfolio. We are committed to providing high levels of product quality and support. The combination of our reputation and that of Palomar’s holds a promising future for SST and our customers.”

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“We are honored to welcome SST International into the Palomar family,” said Bruce W. Hueners, CEO of Palomar Technologies.  He states, “SST’s reputation for providing superior process knowledge and equipment functionality for soldering, brazing and package sealing will round out Palomar’s proven line of precision wire and die bonders.  With SST we combine years of understanding in the unique materials and exacting processes of microelectronic assembly, especially eutectic bonding, and are passionate about being indispensable to our customer’s success.”

About SST International

SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment.  For more information, visit www.sstinternational.com.

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire and wedge bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.


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Media Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

Tags: Announcements, Acquisition, SST International