Latest news in micoelectronics, optoelectronics, LED assembly and complex hybrid packaging from Palomar Technologies.

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Palomar Technologies To Exhibit at 2009 Strategies in Light Exhbition and Conference

Posted by Palomar Technologies MarCom Team on Wed, Feb 11, 2009

Carlsbad, CA – February 11, 2009 – Palomar Technologies announced today it will return to exhibit at the 2009 Strategies in Light Exhibition and Conference to be held February 18 – 20, 2009 in Santa Clara, California. Palomar Technologies will be exhibiting in booth #606 at the Strategies in Light Exhibition and Conference where microelectronics experts will explain how Palomar’s wire bonding and die attach equipment perform the necessary assembly processes to achieve high brightness while achieving thermal dissipation and maximum light extraction.

Palomar Technologies is a leading provider of automated precision microelectronic assembly equipment and contract assembly services that serves industry leaders in telecommunications, medical, defense and aerospace and commercial high-technology. Added applications at Palomar Technologies in 2009 include wafe scale packaging, chip-on-flex, advanced Gold ball and stitch bonding, Gold stud bumping for GGI (Gold Gold Interconnect) as well as epoxy and eutectic solder and thermo-compression bonding processes.

Palomar Microelectronics is the development, test, and contract assembly division of Palomar Technologies. Their microelectronic assembly services include advanced wire bonding, gold stud bumping, wafer scale packaging and device bonding for GGI processes, precision component placement for high-power LEDs, optoelectronics, MEMS, microwave/RF, multichip modules (MCMs), and hybrid microcircuits. Palomar optimizes precision placement and high-thermal conductivity interconnects of high-power LED packaging through the use of field-proven automated component placement systems and pulse heat eutectic die attach equipment. Palomar’s high-density wire-bonded connections are accurately placed in tight areas,have consistent loop structure, and connections strong enough to withstand mechanical shock and stresses due to large thermal variations.

Strategies in Light is a business conference and exhibition focused on high-brightness LEDs produced by Strategies Unlimited and PennWell Corporation. It is the longest-running and the largest conference in the HB LED industry, and the premier annual forum for presenting current commercial developments in high-brightness LED applications and providing unparalleled networking opportunities for component and equipment suppliers, manufacturers, and end-users of HB LED devices.

About Palomar Technologies
Palomar Technologies (formerly part of Hughes Aircraft Company) is the world’s foremost supplier of automated high-precision wire bonders, die bonders and component placement systems combined with process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers.

Topics: die bonders, eutectic die attach, die bonding, contract assembly in microelectronics, automated component placement systems, Epoxy Die Attach, assembly and packaging, eutectic process, die bonder, eutectic, Strategies in Light

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