Speciality refers to rare or uncommon lead frame types. These type of applications require highly customized and often flexible packaging equipment. Depending on the lead frame, a manufacturer will have to design a carrier to present the lead frame itself.
Learn more. Download the "Odd-Form Factor Package Wire Bond Case Studies" whitepaper.
Experts at Palomar Technologies are able work 
with a variety of lead frames and incorporate them into fully automatedmaterial handling solutions. With advances in microelectronics, speciality lead frames are becoming more common as odd-form packages become grow further in sophistication. In IC lead frames, photo-etching processes are often used in manufacturing—these enable quick design turns, increase package numbers, allow for things such as higher pin count and achieve greater overall yield. In high-reliability applications, such as TO CANs,
speciality lead frames are incorporated in
automated material handling systems.
Palomar Technologies Solution
Palomar Technoloiges is well known for the large work areas in both wire bonder and die bonder machines, such as the 8000 Wire Bonder and 3800 Die Bonder. These large work areas give its users great flexibility with inline conveyors and associated lead frames. Atypical packages that were traditionally found mostly in aerospace and defense applications, are being used now in more mainstream technologies, specifically those in the optoelectronic (ie, VCSEL, LED, etc) markets.
