A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGAs offer three main advantages:
- High density. BGAs are a solution for production of miniature packages for an integrated circuit with many hundreds of pins. BGAs do not have the common issue of adjacent pins bridging together when the solder is factory-applied to the package.
- Heat conduction. BGA packages with discrete leads (i.e. packages with legs) are the lower thermal resistance between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.
- Low-inductance leads. BGAs, with their very short distance between the package and the PCB, have low inductances and therefore have far superior electrical performance to leaded devices.
Palomar Technologies Assembly Services (“Assembly Services”) offers unique assembly methods supporting flux-less Micro Ball Grid Array (BGA) solder reflow. More specifically, Assembly Services has recently developed a solder reflow process for SAC405 Micro BGAs without the need for a flux. Click here to learn more about flux-less micro BGAs from Assembly Services General Manager, Don Beck.
