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Palomar Technologies To Exhibit at Electronic Components and Technology Conference and Discusses HB LED Assembly in Free On-Demand Webcast

Posted by Palomar Technologies MarCom Team on Tue, May 24, 2011

Carlsbad, CA – May 24, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at the 2011 Electronic Components and Technology Conference (ECTC) in Orlando, FL, May 31 – June 3.

Palomar Technologies is offering complimentary passes to ECTC 2011. Dale Perry, regional sales manager for the Eastern Americas, will be at booth #419 to discuss the latest features and advancements in high-accuracy die attach and high-precision wire bond and ball bump processes. Palomar Technologies’ 3800 Die Bonder—the fully automated and ultra-flexible component placement system capable of a placement accuracy of +/- 7 microns and repeatability of 3.5 micron at 3 sigma—was recently awarded the 2011 New Product Introduction award for its efficiency and versatility to perform such processes as AuSi/AuSn eutectic attach. Visit with Mr. Perry to learn more about the 3800 Die Bonder and its microelectronic packaging capabilities.

Assembly Services (a division of Palomar Technologies) has developed an efficient process flow in HB LED application production. Julie Adams, director of worldwide sales for Assembly Services, will be on-site at ECTC 2011 to engage in discussions regarding precision microelectronic contract assembly solutions. Assembly Services general manager, Don Beck, discusses the latest advancements in a free on-demand webcast “Automated Precision Assembly for High-Volume HB LED.” Watch now to learn more.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit

Topics: 3800 die bonder, LED applications, eutectic die attach, eutectic soldering process, LED packaging, eutectic process, die bonder, HB LED, eutectic, AuSn, gold tin die attach, NPI Awards, ECTC

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