Palomar Technologies Again Achieves Year-Over-Year Revenue Growth and Profitability

Posted by Rich Hueners on Thu, Jan 13, 2011

Carlsbad, CA – January 13, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it sustained growth for the fourth consecutive year. “I am pleased to announce the closure of another successful fiscal year at Palomar Technologies. The hard work and dedication of Palomar’s worldwide team has resulted in our fourth consecutive year of positive growth in revenue and profitability,” stated Bruce W. Hueners, president and CEO of Palomar Technologies. “Our performance has provided a solid foundation for continued expansion of the company to better serve our customers.”

Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world. For more information on current open positions, please email resumes@bonders.com.

Last year, Palomar Technologies launched its newest high accuracy die attach machine, the 3800 Die Bonder. Built on the proven platform of the 3500 Die Bonder, the 3800 enables customers to achieve up to 2600 UPH with 3.5 micron-3 sigma repeatability. This capability is achieved across a large 35.5”x20” (710 sq in) work area where multiple eutectic, epoxy, die ejection, wafer handling and inline assembly options can be integrated. A new ergonomic user interface, linear motors and the most advanced production software ensures high reliability and control in micro/optoelectronic packaging.

Assembly Services is the precision contract assembly services division of Palomar Technologies, providing prototyping, test, measurement and production for high accuracy and complex wire and die attach applications. To meet customer demand, an additional clean room space was recently added, increasing production capacity by 50%. Assembly Services expertise includes development and production for applications such as HB LEDs, RF Power Modules, Military Hybrids and Laser Diode Packages.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Tags: 3800 die bonder, die bonders, eutectic die attach, eutectic soldering process, die bonding, Contract Assembly, contract assembly in microelectronics, Epoxy Die Attach, eutectic process, die bonder, eutectic, large area bonder, inline assembly