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Advanced Solutions Division - Usa

OSAT Headquarters

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Serving North America's Advanced Photonics and Microelectronics Packaging and Assembly Needs

High mix, low volume process development, prototyping, and contract assembly services run by Palomar Technologies Advanced Solutions Division, is strategically located within our headquarters in Carlsbad, CA.  Here, our highly skilled in-house engineering staff and technicians remain close to Palomar Technologies design and manufacturing engineers, providing a close feedback loop and reducing any downtime. Together, we’ll help you become the leader in your market by providing state-of-the-art assembly services that are capable of ultra-high precision die attach, wire bonding, ribbon bonding, and vacuum reflow.
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OUR LABORATORIES OFFER:

  • Experienced engineering, purchasing and technical staff
  • Cost-effective alternative to investing in capital equipment
  • Immediate access to manufacturing expertise and increased capacity without staffing increases
  • Prototyping devices and manufacturing methods quickly and efficiently evaluated
  • Class 1000-10000 clean room spaces
  • Secure work areas with ITAR certification
  • Temperature, humidity, ionization control
  • Electro-static discharge (ESD)
  • Secure warehouse
  • Strict IP confidentiality
Download the Data Sheet
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Where Complex Assemblies Go from Prototype to Production

Discover the role of our Advanced Solutions Division in driving innovation. Explore the dynamic world of technology and its dedication to shaping the future.

Whether it is turnkey production from low to high volume manufacturing , or new product prototyping and innovation, Palomar's Advanced Solutions Division is uniquely equipped to handle your advanced assembly needs. Experienced engineering and technical staff, flexible and precise automated manufacturing equipment, sophisticated metrology, and significant production capacity are at your disposal to provide the best solution catered to your situation. 

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Every Capability Behind Production Confidence

Die Attach
  • Epoxy Die Attach
    • Conductive
    • Non-conductive
    • UV cure
    • Snap cure
    • Anisotropic adhesive
  • Eutectic Die Attach
    • Preform
    • Pre-deposited / Back-side metalized
    • Solder paste
    • Void-free soldering, flux-free attach
  • High Accuracy Component Placement
  • Flip Chip
  • Thermocompression
  • Glass Sealing
  • Wafer (up to 12”)
  • Deep Access
Used Machines
Wire Bonding
Used Machines
Additional Capabilities
  • Hermetic Package Sealing
  • High Vacuum MEMS Packaging
  • Die Sorting
  • Wire Pull Testing
  • Die/Shear Testing
  • Plasma Cleaning: single gas, multiple gas, argon, oxygen, forming gas
  • Encapsulation
  • Video Measurement
  • Scanning Acoustic Microscope (SAM)
  • Scanning Electron Microscope

*Consigned test equipment floor space for special applications available

Used Machines
  • Royce Tester
  • Royce Die Sorter
  • SST Vacuum Reflow
  • SCI Plasma Cleaning
  • Keyence VHX-1000
  • Nikon VMR, Sonix CSAM
Download the Data Sheet

 

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