High-Power & Edge-Emitting Lasers
High-power laser diodes (HPLDs) and edge-emitting lasers drive materials processing, medical, communications, and defense systems. Each depends on high-accuracy placement, often with difficult fiducials, and a bond that pulls heat away from the emitter.
How Palomar helps:
- Eutectic AuSn die attach for high-power laser diodes
- High-accuracy X, Y, and theta placement to hold alignment tolerances
- Fluxless, void-free solder attach for stable thermal paths
- Mixed technology assemblies combining eutectic and epoxy bonds
VCSELs & Optical Interconnects
VCSELs, photodiodes, and DFB lasers sit inside transceivers and sensing modules where interconnect quality affects signal integrity. Fine ribbon between the ICs and optical components improves signal-to-noise ratio.
How Palomar helps:
- VCSEL, photodiode, DFB laser, and lens attach on one die bonder
- Fine ribbon bonding for optical interconnects
- Accurate wire bonding, including deep-access bonding for complex packages
- Low-void die attach for high-power pump lasers
Platforms Used in Laser Assembly
Palomar Die Bonders
3880-II Die Bonder
Palomar Die Bonders
6500 Die Bonder
Palomar Wire & Wedge Bonders
9100 Wedge Bonder
Sst Vacuum Reflow Systems
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