Bond Data Miner
Bond Data Miner is a comprehensive and centralized data management and analysis system that provides machine and process trend monitoring for increased utilization and yields, along with predictive maintenance.
Category
Die Bond Features, Wire Bond Features
Processes
- Silver Sintering Die Bonding
- Eutectic Die Bonding
- Epoxy Die Bonding
- UV Die Bonding
- Solder Paste Die Bonding
- Thermocompression Die Bonding
Applications
- Large complex hybrids
- HB/HP LED arrays
- Optoelectronic packaging
- Microwave modules
- RF packages
- Hybrid microcircuits
- MEMS / MOEMS
- VCSEL, PD, DFB Laser, Lens Attach
- Solid state lasers
- RF GaN 5G power amplifiers
- RF power amplifier
Pulsed Heat Systems
A high-accuracy pulsed heat system (PHS), specially designed for the 3880 Die Bonder. The PHS allows for a tightly controlled reflow, resulting in a stronger eutectic die bond without voiding. Computer-controlled software provides a highly regulated temperature profile and data feedback throughout the process. The PHS enables precision eutectic die attach through a customizable computer-controlled heating and cooling profile; eutectic programs are customized for individual customer applications and packaging needs.
Category
Die Bond Features
Processes
Applications
- Microwave ModulesRF packages
- MEMS / MOEMS
- Solid state lasers
- RF GaN 5G power amplifiers
- LEDs, RF power amplifiers
VisionPilot®
VisionPilot® is a state-of-the-art referencing technology that sets a new standard for vision processing on Palomar’s die and wire bond platforms that maximizes throughput and enables part inspection both before and after bonding. In contrast to standard referencing technology, VisionPilot utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations. It does so by using a set of boundary curves that are not tied to a traditional pixel-grid. It offers a wide range of tools and features to address the typical challenges of pattern recognition. This includes, but is not limited to, radar referencing, synthetic models, and active feedback.
Category
Die Bond Features, Wire Bond Features
Processes
- Silver Sintering Die Bonding
- Eutectic Die Bonding
- Epoxy Die Bonding
- UV Die Bonding
- Solder Paste Die Bonding
- Thermocompression Die Bonding
- Ribbon & Round Wire Bonding
- Gold or Aluminum Wire Bonding
- Gold Ball Bonding
- Ball Bumping
Applications
- Large complex hybrids
- HB/HP LED arrays
- Optoelectronic packaging
- Microwave modules
- RF packages
- Hybrid microcircuits
- MEMS / MOEMS
- VCSEL, PD, DFB Laser, Lens Attach
- Solid state lasers
- RF GaN 5G power amplifiers
- RF power amplifier
Wafer Die Ejection Systems
A wide selection of integrated wafer die ejection solutions are available which leverage the abilities of Palomar die bonding systems to handle even the most difficult die. From large wafers to multiple wafers, high aspect ratio die to extremely small die, thin wafers to very large die, Palomar’s integrated solutions and customizable options ensure high throughput in every situation.
Category
Die Bond Features
Processes
- Silver Sintering Die Bonding
- Eutectic Die Bonding
- Epoxy Die Bonding
- UV Die Bonding
- Solder Paste Die Bonding
- Thermocompression Die Bonding
Applications
- Optoelectronic packaging
- Microwave modules
- RF packages
- VCSEL, PD, DFB Laser, Lens Attach
- RF GaN 5G power amplifiers
- RF power amplifier
