WIRE BOND FEATURES
Bond Data Miner
Bond Data Miner is a comprehensive and centralized data management and analysis system that provides machine and process trend monitoring for increased utilization and yields, along with predictive maintenance.
Category
Die Bond Features, Wire Bond Features
Processes
- Silver Sintering Die Bonding
- Eutectic Die Bonding
- Epoxy Die Bonding
- UV Die Bonding
- Solder Paste Die Bonding
- Thermocompression Die Bonding
Applications
- Large complex hybrids
- HB/HP LED arrays
- Optoelectronic packaging
- Microwave modules
- RF packages
- Hybrid microcircuits
- MEMS / MOEMS
- VCSEL, PD, DFB Laser, Lens Attach
- Solid state lasers
- RF GaN 5G power amplifiers
- RF power amplifier
Intelligent Interactive Graphical Interface® (i2Gi®)
The Intelligent Interactive Graphical Interface® (i2Gi®) is a sophisticated software tool that supports advanced wire bond control through an intuitive interface. It simplifies programming and provides real-time graphical feedback to the user of bonding performance. i2Gi was designed to enable operating technicians to work smarter, faster, and with more control. Bonder program developers and operators experience real-time bonding and part quality validation.
Category
Wire Bond Features
Processes
Applications
- Large complex hybrids
- HB/HP LED arrays
- Optoelectronic packaging
- Chip-on-board (COB)
- System in packages (SiPs)
- Specialty lead frames
- Automotive assemblies
- Flex circuits
- Multi-chip modules (MCMs)
- Fine pitch devices
- LEDs with running stitch
VisionPilot®
VisionPilot® is a state-of-the-art referencing technology that sets a new standard for vision processing on Palomar’s die and wire bond platforms that maximizes throughput and enables part inspection both before and after bonding. In contrast to standard referencing technology, VisionPilot utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations. It does so by using a set of boundary curves that are not tied to a traditional pixel-grid. It offers a wide range of tools and features to address the typical challenges of pattern recognition. This includes, but is not limited to, radar referencing, synthetic models, and active feedback.
Category
Die Bond Features, Wire Bond Features
Processes
- Silver Sintering Die Bonding
- Eutectic Die Bonding
- Epoxy Die Bonding
- UV Die Bonding
- Solder Paste Die Bonding
- Thermocompression Die Bonding
- Ribbon & Round Wire Bonding
- Gold or Aluminum Wire Bonding
- Gold Ball Bonding
- Ball Bumping
Applications
- Large complex hybrids
- HB/HP LED arrays
- Optoelectronic packaging
- Microwave modules
- RF packages
- Hybrid microcircuits
- MEMS / MOEMS
- VCSEL, PD, DFB Laser, Lens Attach
- Solid state lasers
- RF GaN 5G power amplifiers
- RF power amplifier
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