Awards & Recognition
Celebrating decades of innovation and industry excellence through award-winning technologies, breakthrough systems, and outstanding achievements that continue to shape advanced manufacturing.
2021
Laser Focus World
Innovator’s Award: SST 8300 Series Automated Vacuum Pressure Soldering System
Laser Focus World
Innovator’s Award: SST 8300 Series Automated Vacuum Pressure Soldering System
2019
Laser Focus World
Innovator's Award: Palomar 6532HP Die Bonder
2016
New Product Introduction (NPI) Award for Bonders Winner: 3880 Die Bonder
2015
Ernst & Young Entrepreneur of the Year Finalist: Bruce Hueners
IMAPS 2015 Fellow of the Society Winner: Daniel Evans
2014
New Product Introduction (NPI) Award for Bonders Winner: 8000i Wire Bonder
2013
Top Tech Exec Awards Finalist: Carl Hempel
2012
SDNEC Exporter of the Year Winner
IMAPS 2012 John A. Wagnon Technical Achievement Winner: Daniel Evans
Ernst & Young Entrepreneur of the Year Finalist: Bruce Hueners
CS Industry Awards, Manufacturing Finalist
Top Tech Exec Awards Finalist: Carl Hempel
2011
NPI Award for Electronics Assembly Equipment Winner: 3800 Die Bonder
Global SMT Technologies Awards for Bonders Finalist
TechAmerica High Tech Awards Finalist
IMAPS 2011 Corporate Recognition Award Winner
Appreciated Resolution Award for “Precision Assembly for High-Volume HB LEDs”
Best Paper of the Session for “Evaluation of Test Protocol for Eutectic Die Attach Using High Brightness LEDs”
2010
Global SMT Semiconductor Packaging Die Bonding Equipment Winner: 3800 Die Bonder
TechAmerica High Tech Awards Finalist
Certificate of Special Congressional Recognition presented by Congressman Duncan Hunter
2006
Semiconductor International Editor's Choice Best Product Award Winner: 3500 Die Bonder
2005
Semiconductor International Editor's Choice Best Product Award Winner: 8000 Wire Bonder
Productronica's Global Technology Award Winner: 8000 Wire Bonder
2004
UCSD Connect's Most Innovative New Product Award Winner: 8000 Wire Bonder
SEMICON West's Advanced Packaging Award Winner: 8000 Wire Bonder
2003
Advanced Packaging Award for Die Placement and Attach Winner: Precision Eutectic 6500 Die Bonder
