---
title: Palomar Technologies Develops Wire-Bond-Free Direct Attach for LEDs
description: Direct-attach LEDs are the next generation of solid-state LED emitters.
---

[Latest News in Micoelectronics, Optoelectronics, LED Assembly and Complex Hybrid Packaging ](https://www.palomartechnologies.com/news-room/press-releases)

# [Palomar Technologies Develops Wire-Bond-Free Direct Attach for LEDs](https://www.palomartechnologies.com/news-room/press-releases/bid/101152/palomar-technologies-develops-wire-bond-free-direct-attach-for-leds)

 Written by [Palomar Technologies MarCom Team](https://www.palomartechnologies.com/news-room/press-releases/author/palomar-technologies-marcom-team) | Wed, Feb 01, 2012

**Carlsbad, CA – February 1, 2012 –** [Palomar Technologies](https://www.palomartechnologies.com/), the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced a precision eutectic process development for direct attach [light emitting diodes (LEDs)](https://www.palomartechnologies.com/news-room/press-releases/bid/101152/applications/high-bright-light-emitting-diodes-leds/).

“Direct-attach LEDs are the next generation of solid-state LED emitters that deliver superior value for consumer products and markets that include TV backlighting, camera flash and a variety of general illumination needs,” explains [Donald Beck](https://www.palomartechnologies.com/about-us/management-team/assembly-services-general-manager/), General Manager of Palomar Technologies Assembly ServicesTM. “[Assembly Services](https://www.palomartechnologies.com/precision-microelectronics-assembly-services/) is supporting more than 390 700µm LEDs that are attached with an [Au/Sn solder](https://www.palomartechnologies.com/ausi-and-ausn-eutectic-die-attach-case-studies/) to a single 50mm metal core carrier. Palomar Technologies’ [Pulsed Heat System](https://www.palomartechnologies.com/high-precision-eutectic-die-attach-process-pulsed-heat-stage/) is a major contributor to this development, allowing our [precision die attach systems](https://www.palomartechnologies.com/palomar-3800-ultra-flexible-die-bonder/) to control LED exposure much more effectively than most other processes. The bondpad-down design of direct-attach LEDs eliminates the need for wire bonds, yet improves the thermal management.”

Palomar Technologies is exhibiting at the LED-focused show, Strategies in Light 2012, in booth #709 on February 7-9 in Santa Clara, CA. [Julie Adams](https://www.palomartechnologies.com/about-us/management-team/assembly-services-sales/), Director of WW Assembly Services Sales will be on site to assist in discussions about Palomar Technologies’ current LED packaging capabilities, including direct-attach LED eutectic bonding.

Also on February 7-9, Palomar Technologies is exhibiting as a premier sponsor at IMAPS RF 2012 in booth #RF01, held in San Diego, CA. [Bradley Benton](https://www.palomartechnologies.com/news-room/press-releases/bid/101152/about-us/management-team/western-north-america/), Western Americas Sales Manager, will be presenting an overview of Palomar Technologies’ solutions and [advanced RF automated packaging](https://www.palomartechnologies.com/news-room/press-releases/bid/101152/rf-microwave-and-optoelectronic-packaging-die-and-wire-bonding-case-studies/) processes on February 8 at 1:00pm, local conference time.

Contact Palomar Technologies to arrange an on-site meeting at either Strategies in Light 2012 or IMAPS RF 2012.

**About Palomar Technologies**  
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, [large work area die attach](https://www.palomartechnologies.com/palomar-3800-ultra-flexible-die-bonder/) and [wire bond equipment](https://www.palomartechnologies.com/8000-wire-bonder/ball-stud-bumper/) and [precision contract assembly services](https://www.palomartechnologies.com/precision-microelectronics-assembly-services/). Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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