CARLSBAD, CA - March 14, 2011 - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will showcase live demonstrations of the 3500-III Die Bonder at SEMICON China 2011 in Shanghai.
Palomar Technologies will exhibit a 3500-III Die Bonder at booth #3615 at the SEMICON China 2011 conference on March 15-17. In conjunction with the high-precision die bonder machine, Palomar Technologies will offer demonstrations of a Royce Instruments DE35-ST Mechanized pick-and-place system and a Hybond, Inc., UDB-141 Semi-automatic Eutectic Die Bonder. Palomar Technologies Asia Director, Mr. PH Chan, will be on-site at SEMICON China 2011 to engage in discussions of Palomar Technologies high-accuracy die attach and wire bonder systems and solutions.
Palomar Technologies is sharing prominent technical papers for free download on Semiconductor Packaging News. Highlighted is Odd-Form Factor Package Wire Bond Case Studies, a technical paper exploring the wire bonding requirements of several device cases considered odd form factor package formats when compared to mainstream semiconductor packaging. Solutions to wire bond packages in the RF, automotive, and optical markets are also discussed.
Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
