CARLSBAD, CA - March 4, 2011 - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its involvement in the IMAPS Device Packaging conference on March 8-9 in Scottsdale, AZ.
Account manager for Western North America, Bradley Benton, will be on site at the IMAPS Device Packaging conference at booth #16. To ensure an in-person meeting with Mr. Benton, register with IMAPS for a free admission pass to the Device Packaging exhibitors' show floor.
Palomar Technologies is sharing prominent technical papers for free download on Semiconductor Packaging News. Highlighted is Improved Wire Bond Reliability, a white paper providing an in-depth look at the significantly improved integrity of a wire bond interconnect through the proper use of auxiliary wires, such as stand-off stitch wire bonding.
"We value knowledge sharing and partnering with our customers," states Daniel Evans, Palomar Technologies senior scientist. "By having a deep understanding of our equipment as applied across a wide variety of applications we can leverage this experience to enable our current and future customers to make educated process development decisions when working with our die and wire bonding engineers."
Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore as well as a specialized staff of service technicians located around the world.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
