Die bonding (die attach) is the process of attaching a die (or chip) to a substrate, package, or another die. Palomar machines enable two levels of attachment: in situ eutectic die attach and epoxy die attach, and en masse void-free die attach.

Eutectic die attach is a highly controlled die attach process for high reliability, high-accuracy requirement devices. Void-free die attach assembly processes are used when heat must be transferred away from the die or other critical components to avoid thermal failure. Applications used for eutectic die attach include RF Power Amplifiers, Military Hybrids, MMICs, high power semiconductor modules, and laser pump diodes.

Epoxy die attach is the most commonly used die attach process due to price point and speed. Applications used for epoxy die attach include transistors, encapsulation of wire bonds, LED attachment, MCMs and hybrids.