Eutectic die attach is a highly controlled die attach process for high reliability,
Epoxy die attach is the most commonly used die attach process due to price point and speed. Applications used for epoxy
The 3880 Die Bonder is designed for fully automated epoxy and eutectic
The 5100 Vacuum Pressure Furnace is used for high production void-free soldering of microelectronic packages and components. Its vacuum and pressure furnace provides precise automatic control of heating and cooling ramp rates. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig.
The 3130 Vacuum Pressure Furnace is used for production soldering, glass sealing, and brazing of microelectronic packages and components. A vacuum and pressure furnace that provides automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig.