System Debuts
2015
- Debut of the 3880 Die Bonder
- Debut of the 9000 Wedge Bonder
2013
- Debut of the 8000i Wire Bonder/Ball Bumper
- Debut of the 3500-R Die Bonder
2010
- Debut of the ultra flexible 3800 Die Bonder
2000-2009
- Debut of the precision eutectic 6500 Die Bonder
- Debut of the 8000 Wire Bonder
- Debut of the 8000 Ball Bumper, a variation of the 8000 Wire Bonder
- Debut of the 3470-II Wedge Bonder
- Debut of the 3500-III Automated Component Placement System
- Debut of 2100 C Laser Interferometer
- Debut of the wafer scale packaging eutectic 6500 Die Bonder
1995-2000
- Debut of the CBT automatic gold 6000 Wire Bonder
Exclusive Technologies
- Adaptive Bond Deformation™(ABD)—for ultimate control over ball and stitch deformation
- Bond Data Miner™(BDM)—a software feature that provides part traceability, predictive process capability, and monitors machine fitness
- Digital Dispensing™—very precise dispensing for low volume applications
- Dual-Axis Bond Head
- Enhanced Loop Mode™(ELM)—provides exceptional long, low loop capability, with loops up to 10mm
- High-Accuracy Placement with Double Pick-and-Place
- i2Gi™: Intelligent Interactive Graphical Interface™
- Measuring Electrical Interconnect Integrity
- planarBump™—an advanced packaging option on the 8000 Wire Bonder & Ball Bumper that uses gold wire to produce tailless ball bumps
- Platinum Wire Bonding
- Positioning Optical Fibers
- Tailless Ball Bump
- Ultrasonic Wire Bonder and Transducer Improvements
- VisionPilot™ with Radar Referencing™
- Wire Conveyance with Contactless Slacking