The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles along the way including everything from diverse teams scattered across the world to simply not understanding how the manufacturing process of die bonding, wire bonding or vacuum reflow impacts the package design and visa versa. In this article the challenges faced from package design and prototyping, through process development and process optimization are presented to ensure the device can indeed be manufactured with the desired throughput and quality.

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