SST 3130 Vacuum Pressure Furnace

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The SST 3130 is a deep chamber resistive heat vacuum and pressure furnace for void free solder joints without the use of flux, resulting in high reliability electronic components. The 3130 provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. The system is used in both production and research environments for flux-free soldering, brazing, annealing, and glass sealing of components and packages for microelectronic applications.




  • Fiber Optic Laser Package Assembly
  • GaAs/GaN die attach
  • Glass to metal seals
  • Brazing
  • Pressure sensors


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