Pulsed Heat System

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A high-accuracy pulsed heat system (PHS), specially designed for the 3880 Die Bonder. The PHS allows for a tightly controlled reflow, resulting in a stronger eutectic die bond without voiding. Computer-controlled software provides a highly regulated temperature profile and data feedback throughout the process. The PHS enables precision eutectic die attach through a customizable computer-controlled heating and cooling profile; eutectic programs are customized for individual customer applications and packaging needs.




  • Microwave ModulesRF packages
  • Solid state lasers
  • RF GaN 5G power amplifiers
  • LEDs, RF power amplifiers


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