Process and Reliability Advantages of AuSn Eutectic Die AttachDownload the Paper!
High-power semiconductor devices must be mounted using a robust die-attach material that can handle the temperature fluctuations generated by the chip and mechanical stresses due to CTE mismatches between the die material and the substrate it is mounted to. Traditionally, various die-attach products, such as metal-filled conductive epoxies, high lead-containing solders, and gold-silicon solders, have been sufficient to mount the chip and have it perform reliably for the life of the device it operates. However, the trend toward increasing heat generation, the demand for compact devices, the enactment of RoHS and REACH legislation, and the transition to GaAs chips, limit the use of conventional materials. The demand for high reliability in power devices, in light of these industry trends, has led engineers to evaluate various new materials for their die-attachment.
The use of a high temperature solder preform is proposed and demonstrated for use as a die-attach material in high power devices. The suggested solder preforms are eutectic gold-tin and may be implemented for high volume or lab quantity adoption using a Palomar Technologies’ die bonder. This equipment is capable of handling the complete die-attach process, including high-accuracy pick-and-place of substrates, eutectic gold-tin preforms, and components; eutectic die-attach; and pulsed-heat reflow using a computer controlled Pulse Heat Stage (PHS). Each of these steps is precisely controlled to offer a near void-free eutectic die-attach between the device and its substrate. This is critical for thermal and electrical stability in high power applications. When the substrates, preforms, and components are supplied in high volume packaging, the assembly line can be fully automated, which enables a reduction in the cost of ownership and improves process yields.
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