Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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Download the paper! Typical failures in IGBT power modules are often the result of CTE mismatches, which cause thermo-mechanical stresses that lead to solder fatigue and constitutes itself in the form of cracking or delamination. The overheating occurs in the areas of poor heat transfer (cracks/delaminations), which leads to faster crack propagation. The surface overheating also leads to wire/ribbon bond lifts or heel cracks. With this case study, it has been demonstrated that using the above method of vacuum reflow utilized in an SST 8300 Series Automated Vacuum Soldering System, it is possible to achieve a very low void soldering result (around 1% on average) while soldering a large DBC substrate to Ni plated base plate with SAC 305 or Sn95Sb5 preforms. The low void rate mitigates the likelihood of solder fatigue and overheating, reducing failure rates and increasing IGBT power module reliability.
Power Modules: Typical Failure Modes and How to Solve Them
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