Optimizing Throughput in Semiconductor Manufacturing

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One of the most important misconceptions in optimizing throughput is not understanding that throughput is not based solely on a machine’s maximum axis speed. A machine’s effective units per hour (UPH) is a combination of many factors that even extend past the equipment’s capabilities, into the qualities of the systems around it. This article will walk through these various factors and influences on throughput, with specific consideration to bonding equipment, which will leverage Palomar’s decades of experience.

Beginning with an analysis of typical production processes, various elements that contribute to overall throughput will be touched on briefly to highlight how they fit into a larger picture before discussing them in depth later on in this article. Additionally, there will be some background information on automated lines where optimizing production volume is the most involved and complex. Transitioning from the overview, various influences from automated handling equipment will be covered in detail. Points such as loading/unloading times, tooling size considerations, and the unavoidable existence of bottlenecks will be explored. Next, the challenges of balancing process control and yield will be discussed with the aim of understanding what optimal “true” production volume is for multiple scenarios. Finally, the paper will close with diving into the effects of machine downtime and what types of factors feed into total line uptime and therefore its effects on consistent device production.

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Optimizing Throughput Semiconductor Packaging paper


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