Odd Form Factor Package Wire Bond Case Studies

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Although effort continues in the semiconductor packaging industry to reduce package size along with the never ending pursuit of cost savings through standardization and continued optimization, there remain a significant number of applications which require a wildly different set of capabilities for wire bonding. This paper will explore the wire bonding requirements of several device cases that could be considered odd‐form factor package formats when compared to mainstream semiconductor packaging. Example cases are presented to show the challenges and solutions to bond packages in the RF, Automotive, and Optical markets with large form factor (12inch x 6inch), deep reach (0.535 inch), leads, pins, and other challenges. (Odd‐form factor can be loosely characterized as ‘hybrid micro/opto electronic packages’.)

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Multipurpose Wire Bonding_Bumps, Wires, Combination Interconnects, and Operation Efficiency


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