Guide to Modern Wedge Bonding

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Wedge bonding is a technical process with a long history, tracing back to early developments in the 1950s. In recent years, microelectronic wire bond process and packaging engineers have debated whether to use ball or wedge bond technologies with applications such as RF designs and fine-pitch packaging. Low profile interconnects or fine pitch in key market segments requires wedge bonding.

New methods and control tools are available today to meet modern wedge bond needs. 

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