Mixed Attachment Technology Studies in RF & Optoelectronic Packages Requiring High Accuracy PlacementDownload the Paper!
RF & Optoelectronic packages continue to shrink in size with less space for die. Power densities are increasing as well. Packaging engineers are exploring a switch from conductive adhesive to eutectic solder attachments on high power components. Lower power components still allow adhesive attachment but have their own challenges due to tight spacing. This paper explores a range of case studies that demonstrate both eutectic and adhesive assembly and the results for closely spaced components.
An overview of the technology and the placement accuracy and attachment method is presented for eutectic and adhesive based attachment for components ranging from 0.18mm [7.1mil] x 0.18mm [7.1mil] x 0.20mm [7.9mil] Si die to 1.7mm [67mil] x 1.4mm [55mil] x 0.16mm [6.3mil] GaAs die. Component spacing of 60μm or less create challenges in keeping epoxy or solder from squeezing between die.
A review of tools, guidelines, and actual results will be shared in this paper.
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