Micron-Level Placement Accuracy for High Aspect Ratio Die in Printing ProductsDownload the Paper!
Applications requiring ultra high placement accuracies of 1um to 5um are required in several applications: Arrayed Laser Print Heads, Arrayed Ink Jet Print Heads, P-Side- Down Laser Applications, and multi-channel optical communication products.
Arrayed print head technology, laser or ink jet, utilizes arrays of lasers or ink jets on individual die. The lithography processes used to create the arrays on each die are more than adequate to produce high quality images. Conceptually, a single long die would allow a single-pass printing on the print medium. However, there is a practical limit to the length and width of die without affecting yield and handling damage. Additionally, the mixing of monotone and color printing requires that multiple rows or columns of print pixels be precisely aligned with respect to each other. Although some correction can be accomplished in electronics by modifying the print timing of each pixel, pixels must be aligned within a few microns for high quality printed images.
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