Improving Vacuum Solder Reflow for Challenging Power Module Packaging

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The Power Module Packaging Market is projected by some analysts to have a CAGR of nearly 10% from 2019 through 2025, driven by the competing demands for more global energy consumption and the push to reduce the impact of fossil fuels on our environment. Sustainable energy and savings through improved efficiencies will drive improvements in the chip and packaging technologies used in power electronics.

Increased energy consumption worldwide means an increased need for power electronics devices to meet the requirements along the electrical energy supply chain, from generation to consumption. These devices are required to be more efficient and to operate under
more stressful conditions, such as higher temperatures and more power cycles. This is particularly true for the automotive industry, as
it transitions from fossil-fuel-powered engines to hybrid electric and battery electric vehicles.

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Typical power module construction


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