Sealing MEMS Devices in Ceramic Packages in a High Vacuum Atmosphere

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The increasing demand for advanced Microelectromechanical Systems (MEMS) has placed an important focus on the packaging of these systems. MEMS are highly miniaturized devices, or arrays of devices, which combine electrical and mechanical components that are fabricated by using integrated circuit batch processing techniques. Appropriate packaging requires the encapsulation of delicate microelements in ways that permit normal handling while also protecting the integrated circuit from harsh environments.

The integration, functionality and cost of packaging continue to be major issues as MEMS applications enter a variety of marketplaces. Here are a few of the many areas in which MEMS are being applied.

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