Micron-Level Placement Accuracy for Wafer-Scale Packaging & Optoelectronics

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Contents of this eBook:

  • Terms / Material & Process Considerations
  • P-Side Down Laser Attachment
  • Equipment Overview
  • Capability P-Side Versus N-Side Measures XY
  • Wafer-Scale Considerations and Results
  • Solder Aging
  • Area Placement Accuracy
  • Post Processing (Assembly, Test, Saw)

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Micron-Level Placement Accuracy for Wafer-Scale Packaging & Optoelectronics

 

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