Micron-Level Placement Accuracy for Wafer-Scale Packaging & Optoelectronics
Download the eBook!Contents of this eBook:
- Terms / Material & Process Considerations
- P-Side Down Laser Attachment
- Equipment Overview
- Capability P-Side Versus N-Side Measures XY
- Wafer-Scale Considerations and Results
- Solder Aging
- Area Placement Accuracy
- Post Processing (Assembly, Test, Saw)
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