Gold Bump Technologies: Plating vs. BallDownload the Paper!
At first glance one might think that batch level processing (plated bumps) is preferred above serial processing steps (wire bonded ball bumps). In the case of gold bumping of wafers, there is more than meets the eye. Ball bumping can provide an engineer several advantages over plated-up bumps.
• Ball bumps can be significantly more cost effective than plated bumps;
• Ball bumps can support multiple substrate attach technologies;
• Single pass ball bump shapes are available without the need to planarize; and
• A technique for manufacturing unique thin flat pancake shaped bumps and other shapes are available to the industry.
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