Engineering Resources for
High - Performance Assembly
Access in-depth technical papers and eBooks on wire bonding, die attach, low-voiding solder processes, optical packaging, and more. Practical insights from our applications team to support your next process improvement
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die bonding
Achieving High Accuracy Pattern Recognition For Die Bonding
Automated die bonding requires clear-featured die for vision processing to reliably assemb...
applications,
vacuum reflow
Achieving Low Voiding with Lead Free Solder Paste for Power Devices
Low-cost solder paste for power devices with <5% void concentration across materials, i...
die bonding,
wire wedge bonding
Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies
High-speed optical cables in data server farms with case studies on high-accuracy die atta...
die bonding,
applications
AuSi and AuSn Eutectic Die Attach Case Studies
Thermal management & optimized utilization of eutectic solders in packaging for high p...
applications
Automated Assembly Tool for Precision, High-Speed RF Die Attach Applications
Microchip assembly requires improved hardware, software, automation, and integration to ac...
wire wedge bonding
Automated Precision Assembly for High-Volume HB LEDs
Automated die and wire bonders balance speed and repeatability. This paper presents a proc...
die bonding
Automatic Epoxy Die Attach
Epoxy die attach is a cost-effective, reliable method for attaching components such as tra...
applications
Automating MEMS Packaging
To meet market demand for MEMS products, Design for Automation is crucial for high yield, ...
die bonding,
applications
Balancing Throughput and Process Control for Manufacturing of RF Power Amplifier Assemblies
The 5G rollout will drive growth of RF power amplifier market, requiring increased product...
wire wedge bonding
Benefits of Automated Ribbon Bonding for Microwave Applications
As operating frequencies increase, wire bonding becomes a challenge. Fine ribbon wire inte...
wire wedge bonding
Chain Wire Bonding of a RF SOE Package Using a Gold Ball Bonder
Chain bonding is a cost-effective alternative to wedge bonding for RF-SOE power transistor...
applications
Contract SMT and Microelectronics Assembly in One
Manufacturers must deal with mixed interconnect tech for assemblies, including SMT and Mic...
Efficient Manufacture of IR Sensors – Combining Bonder and Vacuum Reflow Technology
Growing demand for IR sensors due to six megatrends including COVID-19, smart building tec...
die bonding,
applications
Energy and Eco-Sustainability using Pressure-less Silver Sintering for RF Power Electronics
Void-free die attach using Ag sinter paste achieved with fixed-volume jetting and custom s...
Equipment for Advanced Packaging
Automated microelectronic and photonic manufacturing equipment enables product concepts fr...
vacuum reflow,
applications
Extremely Low-Void, Lead-Free Solutions for Power Module Applications Case Study
Power Semiconductors to grow further to meet global energy demand with improved efficienci...
wire wedge bonding
Geometry and Bond Improvements for Wire Ball Bonding and Ball Bumping
Improved consistency and bond quality for mobile devices using Adaptive Bond Deformation. ...
osat services
Global Trends in Logistic Sensor Packaging
Sensor opportunities rise with robotics growth. Logistics drives it; advanced sensors face...
wire wedge bonding
Gold Ball Bumping: An Effective Wafer-Bumping Method
Gold-ball bumping is a popular method for wafer bumping to improve electrical performance ...
wire wedge bonding
Gold Bump Technologies: Plating vs. Ball
Advantages of ball bumps over plated bumps: cost-effective, supports multiple substrate at...
wire wedge bonding,
die bonding
Gold Planar Bumps for Flip Chip Bonding with Challenging Specifications
Semiconductor packaging industry seeks smaller, faster packages. Au Planar bumps are a cha...
applications
High-Brightness Matrix LEDs: Meeting Packaging Challenges
LEDs are bright, efficient, and versatile, and are being used in a wide range of applicati...
high-vacuum furnace
Sealing MEMS Devices in Ceramic Packages in a High Vacuum Atmosphere
MEMS packaging is crucial due to demand for advanced systems. Packaging must protect devic...
wire wedge bonding
Improve Wire Bond Capability and Reliability through Use of Auxiliary Wires
Palomar Technologies offers various auxiliary wire options for wire bonding. These improve...
Justifying the Purchase of Die or Wire Bonder Equipment
Production engineers seek to justify new bonding equipment through financial analysis, pro...
Low Latency Manufacturing For Biophotonics And Medical Packaging
Medical device market doubles by 2025. Palomar offers cost-effective solutions to navigate...
wire wedge bonding
Low Sealed-In Gas Pressure
Equipment and techniques applied during the packaging process to optimize MEMs device perf...
Micron-Level Placement Accuracy for High Aspect Ratio Die in Printing Products
Ultra high placement accuracies of 1-5um required in Arrayed Laser/Ink Jet Print Heads, P-...
die bonding,
applications
Micron Level Placement Accuracy for Wafer Scale Packaging of P-Side Down Lasers in Optoelectronic Products
High-accuracy placement is required in print heads & laser apps. Arrays of lasers or i...
die bonding
Mixed Attachment Technology Studies in RF & Optoelectronic Packages Requiring High Accuracy Placement
Packaging engineers explore eutectic solder attachment on high-power components with less ...
Multipurpose Wire Bonding –Bumps, Wires, Combination Interconnects, and Operation Efficiency
Multipurpose wire bonders meet RF, automotive and optical market needs, accommodate comple...
applications,
wire wedge bonding
Odd Form Factor Package Wire Bond Case Studies
This eBook discusses packaging solutions, case studies, wire bond tools, and equipment for...
applications
Optimizing Throughput in Semiconductor Manufacturing
Optimizing throughput is more than a machine's axis speed. Palomar's article explores fact...
Packaging Developments in 6G and Quantum Communications
Exploring the impact and potential of 6G, as well as adapted legacy manufacturing processe...
Paperless Laboratory: Increased Efficiency and Traceability in Microelectronics Assembly
Palomar Technologies offers high-value add assembly services with advanced technology and ...
Plating Requirements for Soldering Applications
Plating processes produce solderable metallic coatings for electronics. Considerations for...
applications,
vacuum reflow
Power Modules: Typical Failure Modes and How to Solve Them
Vacuum reflow reduces voids in IGBT power module soldering, decreasing failure rates and i...
Process Control and Traceability in High-Reliability and Military Semiconductor Devices
The 5G rollout will drive the growth of RF power amplifier market, requiring increased pro...
die bonding,
applications
Process and Reliability Advantages of AuSn Eutectic Die Attach
Robust die-attach is crucial for high-power semiconductors. Precise assembly with high tem...
applications
Quantum Encryption and Mo(o)re: An Exploratory Overview 2022 to 2050
Quantum tech offers infinite connectivity & unbreakable encryption. Imperative to act ...
applications
RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies
Semiconductor packaging for RF, Microwave, LED, and Optoelectronic devices require differe...
die bonding,
applications
RF/Microwave Die Attach of Gallium Nitride Devices Achieving Less Than 1% Voiding in a Flux-Free Environment
RF, Microwave, LED, Optoelectronic markets have unique bonding requirements compared to ma...
high-vacuum furnace
Soldering Gold Surfaces Using Gold-Tin Solder Material
Soldering surfaces for 80Au/20Sn solder alloy needs high quality metallization with specif...
vacuum reflow
Successful Void-Free Die Attach Using Vacuum Reflow Systems
Vacuum reflow reduces voids in solder interface to avoid overheating & high mechanical...
high-vacuum furnace,
applications
Technical Considerations of Lid Sealing versus Seam Sealing for Electronic Packages
Technical considerations for lid sealing vs seam sealing can consist of technology, therma...
The Telecom Tool Kit: Six Process Tools Enable Packaging of High-Frequency Products
There exist process tools to aid in meeting telecom industry demand and rapid growth thank...
wire wedge bonding
The Great Debate: Ball vs. Wedge
Ball and wedge bonding have been debated; wedge dominates low profile/fine pitch. Chain bo...
osat services
The Journey to Full Scale Semiconductor Packaging Manufacturing
The article discusses obstacles in semiconductor packaging from design to production and p...
vacuum reflow
Void-Free/Flux-Free Die Attachment for Multichip Modules Using Solder Alloys
The pressure variation method uses external gas pressure to achieve voidness results in el...
wire wedge bonding
Wedge Bond Process Optimization Method for 1.5 mil Al Wire on Al Bond Pad
Modern wedge bonders present process challenges. This review shows tradeoffs in bond shape...
die bonding
Automated Epoxy Die Attach
Epoxy die attach is cost-effective and popular for various applications including hybrids,...
die bonding
Automated Eutectic Die Attach
Automatic eutectic attachment is vital for high-performance die attach with flexible autom...
technical services
Buyer's Guide to Microelectronics Packaging Equipment
When purchasing bonder equipment, due diligence is necessary to ensure manufacturer reliab...
die bonding
CAMAX Heated System vs. Palomar Technologies Pulsed Heat Stage (PHS)
This eBook covers the features of Palomar Technologies' PHS eutectic system, including its...
applications,
osat services
Collaborative Manufacturing in Photonics Design
Photonics is a growing industry worth $7-10 trillion. Companies must increase production w...
Automated Data Management & Analysis (ADMA): Contract Assembly Production, Materials & Equipment Data Tracking and Management
ADMA enables pass-down continuity for complex assemblies. Tight process control is crucial...
Frequently Asked Questions: 8000i Wire Bonder/Ball (Stud) Bumper
Details about equipment features, options, and services related to bonding area, wire bond...
wire wedge bonding
Frequently Asked Questions: 9000 Wedge Bonder
Key features of 9000 Wedge Bonder: Loop length, wire bonding, voice coil, clamp, tool leng...
vacuum reflow,
applications
Glass to Metal Sealing
Glass-metal sealing creates a hermetic seal and an electrical path. It withstands high tem...
technical services
Guide to Automated Production Lines
Factory automation streamlines microelectronic assembly and improves efficiency with preci...
wire wedge bonding
Guide to Modern Wedge Bonding
Wedge bonding is a technical process with a long history. Low profile interconnects or fin...
wire wedge bonding
i2Gi®: Intelligent Interactive Graphical Interface®
Palomar's i2Gi is an exclusive feature for customers, managing modern wire bonding from de...
wire wedge bonding
Stand-Off Stitch Auxiliary Wires for Improved Wire Bond Reliability
Auxiliary wires include security wires/bumps and stand-off stitches. Stand-off stitches ha...
die bonding
Introduction to Automated Flip Chip Assembly
Flip chip packages offer small form factor and cost benefits through use of conductive bum...
technical services
Introduction to Automated & Semi-Automated Die Sorting
Evolving designs require updated handling and assembly processes. Die sorting categorizes ...
applications,
die bonding
Micron-Level Placement Accuracy for Wafer-Scale Packaging & Optoelectronics
This eBook covers laser attachment, equipment, wafer-scale, solder aging, and post-process...
applications
Odd-Form Factor Packaging
This eBook discusses packaging solutions, case studies, wire bond tools, and equipment for...
wire wedge bonding
Part Clamping: Vacuum vs. Mechanical
Part clamping is necessary to prevent misalignment and bond failure. The type and strength...
vacuum reflow
SST Strategic Service Plan
The Strategic Service Plan is a support contract for SST systems with emergency service, h...
wire wedge bonding
Wire Bond Pull and Ball Shear Testing
Wire pull tests wire bond strength; upward pull until bond breaks. Shear tests assess ball...
die bonding,
wire wedge bonding,
applications
Wire Bonding for RF-SOE Packages Using a Gold Ball Bonder
An eBook covering chain bonding development progression, RF SOE Bonding, Bumps, and next s...
applications,
vacuum reflow
Achieving Less Than 1% Voiding in GaN Die Attach Processing
High power devices are sources of excessive heat generation, which needs to be removed for...
vacuum reflow,
wire wedge bonding
Automated Die Bonding Levels Playing Field
Palomar's die bonders offer reliability and cost benefits. Palomar Assembly Services meet ...
vacuum reflow
For Die in a Package it’s Always About the Bond
Semiconductor production seeks cost and performance improvements, with a focus on die bond...
applications
For Packaged PICs it’s Always About the Bond
SiP and PIC revolutionize markets. Die bonding key in manufacturing. Palomar experts share...
applications,
vacuum reflow
Improving Vacuum Solder Reflow for Challenging Power Module Packaging
Power module packaging market to grow at 10% CAGR driven by energy consumption and sustain...
die bonding,
vacuum reflow
Low Latency Manufacturing for Biophotonics and Medical Device Packaging
The medical device market will double by 2025 but vendors face significant cost and packag...
die bonding,
applications
Scaling Semiconductor Manufacture for Space and Beyond
Challenges arise in semiconductor manufacturing due to scattered teams not understanding d...
vacuum reflow
The Value of Automation for Ultra High-Precision Applications
Palomar Technologies Assembly Services stresses the importance of automation for ultra hig...
die bonding,
vacuum reflow
Void-Free Die Attach: Why it's important and how to achieve it
Void-free bonding is crucial for high-performance and reliable products as voids degrade p...
