For Packaged PICs it’s Always About the Bond

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Silicon photonic (SiP) devices and photonic integrated circuits (PICs) are revolutionizing telecom/datacom markets. The growing capabilities of PICs have also spawned new approaches to advanced computing and myriad new market opportunities that legacy technologies cannot address. PIC Magazine spoke with the experts at Palomar Technologies to learn how die bonding continues to evolve and play a central role in SiP and PIC manufacturing.

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